multilayer ceramic chip capacitors 1 of 3 creation date : march 09, 2017 (gmt) c3216x7t2j333k115ac tdk item description c3216x7t2j333kt**** applications commercial grade please refer to part no. cga5h1x7t2j333k115ac for automotive use. feature mid mid voltage (100 to 630v) series c3216 [eia 1206] status production (not recommended for new design) size length(l) 3.20mm 0.20mm width(w) 1.60mm 0.20mm thickness(t) 1.15mm 0.15mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 33nf 10% rated voltage 630vdc temperature characteristic x7t(+22,-33%) dissipation factor (max.) 2.5% insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : march 09, 2017 (gmt) c3216x7t2j333k115ac characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c3216x7t2j333k115ac esr c3216x7t2j333k115ac capacitance c3216x7t2j333k115ac dc bias characteristic c3216x7t2j333k115ac temperature characteristic c3216x7t2j333k115ac(no bias) c3216x7t2j333k115ac(dc bias = 315v ) ripple temperature rising c3216x7t2j333k115ac(100khz) c3216x7t2j333k115ac(500khz) c3216x7t2j333k115ac(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : march 09, 2017 (gmt) c3216x7t2j333k115ac associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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